Hesse GmbH, is one of the worldwide leading manufacturers of machines for assembly and connection techniques in the semiconductor industry. We offer high-end technology with the development and manufacturing of fully automated ultrasonic bonding and welding machines as well as laser welding systems; together with standard or product specific automation solutions.

Particularly in the field of E-Mobility, our machines offer the highest standards for the production of connections from cell to cell, cell to busbar, cell to PCB or the electronic assembly of Battery Management Systems (BMS). Additionally we provide software for monitoring ultrasonic-bond-processes, standardized or customer specific automation solutions, customized tools and machines.